Lowongan Kerja Senior Staff Engineer Encapsulation Infineon Technologies Ag Batam

Loker Infineon Technologies AG Batam. Jika kalian sedang mencari lowongan kerja bulan Oktober 2026, maka Anda beradi di website yang tepat. Ada banyak kategori lowongan yang bisa Anda daftar mulai dari lowongan kerja SMA SMK terbaru, hingga lowongan kerja S1. Teman juga bisa mendaftar lowongan kerja online atau offline tergantung ketentuan yang ditulis pada info lowongan yang kami informasikan di mencarikerja.net. Informasi lowongan kerja yang valid, bersumber dari website resmi atau media sosial perusahaan yang berkaitan, dan pastinya tidak ada pungutan biaya apa pun.

Loker Infineon Technologies AG Batam Oktober 2026

Silakan baca info lengkapnya di bawah ini

#WeAreIn for jobs that impact everyone's life.

Optimize. Innovate. Deliver. Join us in redefining manufacturing excellence.

As a Senior Staff Engineer Encapsulation in our Manufacturing and Operations team, find yourself in a high-tech world where silicon wafers evolve into cutting-edge products. In our advanced cleanroom environment, every detail count, and your expertise will help shape the future,
one innovation at a time.

Are you in?

Your role
Key responsibilities in your new role

• Process owner and expert who drives innovation, pre-development and development of Molding process
• Ensure timely development of robust Molding process in accordance to project timeline, yield and cost targets
• Develop unit process with compliance to requirements defined in the Process Development Handbook
• Advocate Design for Manufacturing and Design for Cost
• Demonstrate ability to solve complex problems independently with application of problem-solving tools
• Lead definition and guide process, equipment and material strategies as per alignment with the roadmap
• Support End-to-End activities of projects to ensure smooth ramp up.

Your profile
Qualifications and skills to help you succeed

• Master / bachelor’s degree in engineering and physical science
• Minimum 5 years of working experience in Mold Process Development
• Additional experience in IC Packaging Concept and Process/Equipment Engineering would be an added advantage
• Good knowledge and application: Statistical tools (JMP, CEDA, etc)
• Analytical and problem-solving skills (P/DFMEA, DMAIC, 8D Methodology)
• Proficient in planning and executing Design of Experiment (DoE)
• Good knowledge in analytical (SAT) and metrological tools (Smart Scope, Hisomet, etc)
• Hands-on knowledge/skills in molding process assembly.

#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.

Tata Cara Pendaftaran :

Jika Anda berminat dan sesuai dengan kualifikasi Lowongan Kerja ini, segera kirimkan lamaran dan CV terbaru Anda melalui tautan di bawah ini :

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Apply Now »

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Keterangan :

• Hanya kandidat yang sesuai kualifikasi yang akan dihubungi lebih lanjut.
• Setiap proses rekrutmen tidak dikenakan biaya apapun.

Jika lowongan tersebut belum sesuai dengan keingingan dan kemampuan yang Anda miliki, Coba Anda membaca lowongan yang berhubungan di bawah ini.